Laser Lift Off

Laser Lift off Lab kit
LLO ==> Laser Lift off

Application
 LLO for Flexible OLED
• LLO for ultra thin Si wafer
• LLO for organic semiconductor device
• LLO for flexible device as sensor and detector



Feature of the system
Using DPSS UV Laser with special optics unit to
make homogeneous Line Beam to irradiate the work
by moving X-Y stage to LLO for whore area as R&D
purpose.
1.Very Low Price and ultra compact system
2.Can be use with 100V AC only. (less than 15A)
3.Option for Laser Film Cutting



 Wavelength    355nm 
 Line beam size40mm * 0.4mm 
 Process energy density 25~250mJ/cm^2
(Variable attenuator)
 Beam Overlap0%~98% (Stage control) 
 Work size (mm)Max 150 * 150
Option: G2 (370 * 470) 
 Process Speed5min (100mm panel) 
 Stage strokeL1200 * W900 * H1500 
 UtilityAC100V+-10% , 15A 



Flexible display

Ultra thin Si wafer

Flexible organic device
Ċ
Chang Ricky,
2019年10月28日 下午11:12
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